Our technology is about the right chemistry and the right materials science, put together with an efficient process engineering, that yields a disruptive planarization process for advanced chip manufacturing — one that uses no particles and is sustainable.
With no abrasives, a purpose-built planarization technology that seamlessly integrates into the existing CMP (chemical mechanical planarization) systems — ChEmpower is positioned strong to replace the existing slurries and the pads with its products.
As co-founder CTO Prof Babu puts it, ‘designing the right chemistry for the formulary polish solution together with the chemical moieties built into the polymer backbone of the planarizing pad are key to achieve the material removal rates and superior planarization’.
Co-founder, CEO Dr. Misra adds, ‘the engineering behind the stitching of these chemical moieties and the tailoring of their densities and combinations, is what constitutes a technology platform that is scalable and extendable to new materials in the technology roadmap for advanced semiconductors’.
With no abrasives, a purpose-built planarization technology that seamlessly integrates into the existing CMP (chemical mechanical planarization) systems — ChEmpower is positioned strong to replace the existing slurries and the pads with its products.
As co-founder CTO Prof Babu puts it, ‘designing the right chemistry for the formulary polish solution together with the chemical moieties built into the polymer backbone of the planarizing pad are key to achieve the material removal rates and superior planarization’.
Co-founder, CEO Dr. Misra adds, ‘the engineering behind the stitching of these chemical moieties and the tailoring of their densities and combinations, is what constitutes a technology platform that is scalable and extendable to new materials in the technology roadmap for advanced semiconductors’.